EMAP2019

The 21st Electronic Materials and Packaging Conference will be held in Korea. The former sixteen conferences in Singapore (1999), Hong Kong (2000), and Korea (2001), Taiwan (2002), Singapore (2003), Malaysia(2004), Japan (2005), Hongkong (2006), Korea (2007), Taiwan (2008), Malaysia (2009), Singapore (2010), Japan (2011), Hong Kong (2012), Korea (2013), Taiwan (2014), Portland (2015), Malaysia(2016), Japan (2017), Hong Kong (2018) were very successful. The committee would like to continue to make this meeting successful.